Radiation sensing device

ABSTRACT

A radiation sensing device is provided in the present disclosure. The radiation sensing device includes a substrate and a plurality of semiconductor units. The semiconductor units are disposed on the substrate, and at least one of the semiconductor units includes a first gate electrode, an active layer, and a second gate electrode. The active layer is disposed on the first gate electrode, and the second gate electrode is disposed on the active layer. The second gate electrode has a positive bias voltage during a standby mode. The second electrode may be configured to have a positive bias voltage during the standby mode for improving influence on electrical properties of the semiconductor unit after the semiconductor unit is irradiated by radiation.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of application Ser. No. 15/930,452 filedon May 13, 2020, now allowed, which is incorporated by reference hereinin its entirety.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to a radiation sensing device and anoperation method thereof, and more particularly, to a radiation sensingdevice including semiconductor units and an operation method thereof.

2. Description of the Prior Art

Light sensing technology has been applied in many electronic productsand inspection equipment with the related development, and the lightsensing technology capable of detecting radiation (such as X-ray) is oneof the applications that has received considerable attention. Because ofproperties such as low irradiation dose, fast electronic imaging, andconvenience of viewing, copying, capturing, transferring, and analyzingelectronic images, the traditional approach using films for detectingradiation has been gradually replaced by the digital radiation sensingdevice, and the digital radiation sensing device has become the currenttrend of development of digital medical imaging. In the general digitalradiation sensing device, light sensing units are used to receiveradiation energy and covert the radiation energy into electricalsignals, and semiconductor switching units are used to control thereading of the signals. However, by the influence of the energy and/orthe dose of the radiation during the irradiation, properties of stackedlayers in the semiconductor switching units (such as a semiconductorchannel layer, a gate dielectric layer, and/or a channel passivationlayer) may change, and the electrical performance of the semiconductorswitching units may be influenced accordingly. For instance, negativeshift in the threshold voltage (Vth) of the semiconductor switchingunits may be generated, and there may be problems such as operationfailure of the radiation sensing device accordingly.

SUMMARY OF THE DISCLOSURE

It is one of the objectives of the present disclosure to provide aradiation sensing device and an operation method thereof. A second gateelectrode has a positive bias voltage during a standby mode forrecovering influence on electrical properties of a semiconductor unitafter the semiconductor unit is irradiated by radiation. The electricalperformance of the semiconductor unit may be recovered to be normal, theinfluence of the radiation on the normal operation of the radiationsensing device may be avoided, and the lifetime of the radiation sensingdevice may be extended accordingly.

A radiation sensing device is provided in an embodiment of the presentdisclosure. The radiation sensing device includes a substrate and aplurality of semiconductor units. At least one of the semiconductorunits is disposed on the substrate, and the semiconductor unit includesa first gate electrode, an active layer, and a second gate electrode.The active layer is disposed on the first gate electrode, and the secondgate electrode is disposed on the active layer. The second gateelectrode has a positive bias voltage during a standby mode.

An operation method of a radiation sensing device is provided in anembodiment of the present disclosure. The operation method includes thefollowing steps. A radiation sensing device is provided. The radiationsensing device includes a substrate and semiconductor units disposed onthe substrate. At least one of the semiconductor units includes a firstgate electrode, an active layer, and a second gate electrode. The activelayer is disposed on the first gate electrode. The second gate electrodeis disposed on the active layer. The radiation sensing device is putinto a standby mode, and the second gate electrode has a positive biasvoltage during the standby mode.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic drawing illustrating a radiation system accordingto an embodiment of the present disclosure.

FIG. 2 is a schematic diagram illustrating a part of a radiation sensingdevice according to a first embodiment of the present disclosure.

FIG. 3(a), FIG. 3(b), and FIG. 3(c) are schematic circuit diagrams of apart of the radiation sensing device according to the first embodimentof the present disclosure.

FIG. 4 is a schematic diagram illustrating timings of the radiationsystem according to an embodiment of the present disclosure.

FIG. 5 is a schematic diagram illustrating the relationship between adrain current of a semiconductor unit in the radiation sensing deviceand a gate voltage of the semiconductor unit according to an embodimentof the present disclosure.

FIG. 6 is a schematic diagram illustrating a radiation sensing deviceaccording to an exemplary example of the first embodiment of the presentdisclosure.

FIG. 7 is a schematic diagram illustrating a radiation sensing deviceaccording to another exemplary example of the first embodiment of thepresent disclosure.

FIG. 8 is a schematic diagram illustrating a radiation sensing deviceaccording to a second embodiment of the present disclosure.

FIG. 9 is a schematic circuit diagram of a part of the radiation sensingdevice according to the second embodiment of the present disclosure.

DETAILED DESCRIPTION

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, equipment manufacturers may refer to a component bydifferent names. This disclosure does not intend to distinguish betweencomponents that differ in name but not function. In the followingdescription and in the claims, the terms “include” and “comprise” areused in an open-ended fashion, and thus should be interpreted to mean“include, but not limited to . . . ”.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or directly connected to the other element or layer, orintervening elements or layers may be presented (indirectly). Incontrast, when an element is referred to as being “directly on” or“directly connected to” another element or layer, there are nointervening elements or layers presented.

The ordinal numbers, such as “first”, “second”, etc., used in thedescription and the claims are used to modify the elements in the claimsand do not themselves imply and represent that the claim has anyprevious ordinal number, do not represent the sequence of some claimedelement and another claimed element, and do not represent the sequenceof the manufacturing methods. The use of these ordinal numbers is onlyused to make a claimed element with a certain name clear from anotherclaimed element with the same name.

It should be understood that embodiments are described below toillustrate different technical features, but these technical featuresmay be mixed to be used or combined with one another in different wayswithout conflicting with one another.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic drawingillustrating a radiation system according to an embodiment of thepresent disclosure, and FIG. 2 is a schematic diagram illustrating apart of a radiation sensing device 101 according to a first embodimentof the present disclosure. As shown in FIG. 1 , in some embodiments, anobject OB (such as human or other creatures or non-creatures) may belocated between a radiation generating device 901 and the radiationsensing device 101. Radiation may be generated by the radiationgenerating device 901 to the object OB, and the radiation sensing device101 located behind the object OB is used to perform radiation sensing.The radiation sensing device 101 may convert the received radiationenergy into electrical signals, and a processor device 902 (such as acomputer device) connected with the radiation sensing device 101 mayperform signal processing to generate a corresponding radiation imageaccordingly.

Please refer to FIG. 2 , FIG. 3(a), FIG. 3(b), and FIG. 3(c). FIG. 2 isa schematic diagram illustrating a part of the radiation sensing device101 according to the first embodiment, and FIG. 3(a), FIG. 3(b), andFIG. 3(c) are schematic circuit diagrams of a part of the radiationsensing device 101 according to the first embodiment. As shown in FIG. 2, the radiation sensing device 101 in this embodiment may include asubstrate 10 and a plurality of semiconductor units T. However, toconcisely explain technical features of the present disclosure, there isonly one semiconductor unit T illustrated in the drawings of the presentdisclosure. The semiconductor units T are disposed on the substrate 10,and at least one of the semiconductor units T includes a first gateelectrode G1, an active layer SC, and a second gate electrode G2. Theactive layer SC is disposed on the first gate electrode G1, and thesecond gate electrode G2 is disposed on the active layer SC.Specifically, in some embodiments, the semiconductor unit T may furtherinclude a gate dielectric layer 12, a source electrode SE, and a drainelectrode DE. The gate dielectric layer 12 may be disposed between thefirst gate electrode G1 and the active layer SC, and the sourceelectrode SE and the drain electrode DE may be disposed on the activelayer SC and the gate dielectric layer 12, but not limited thereto. Inaddition, the radiation sensing device 101 may further include aprotection layer 14 disposed on the source electrode SE, the drainelectrode DE, and the active layer SC, and the second gate electrode G2may be disposed on the protection layer 14. In some embodiments, theprotection layer 14 may be regarded as a passivation layer or a channelpassivation layer, but not limited thereto.

In some embodiments, the radiation sensing device 101 may furtherinclude at least one light sensing unit PU disposed on the substrate 10,and the light sensing unit PU may include a photodiode, a capacitorstructure, or other suitable photoelectric conversion unit. For example,the light sensing unit PU may include a first semiconductor layer P1, anintrinsic semiconductor layer P2, and a second semiconductor layer P3disposed in a direction perpendicular to a surface of the substrate 10(such as a first direction D1), and the intrinsic semiconductor layer P2may be sandwiched between the first semiconductor layer P1 and thesecond semiconductor layer P2 accordingly. The first semiconductor layerP1 may be electrically connected with a first terminal electrode E1, andthe second semiconductor layer P3 may be electrically connected with asecond terminal electrode E2.

As shown in FIG. 2 , in some embodiments, the radiation sensing device101 may further include a first insulation layer 16, a second insulationlayer 18, a first electrically conductive layer 20, and a thirdinsulation layer 22. The first insulation layer 16 may be disposed onthe second gate electrode G2 and the protection layer 14, the firstterminal electrode E1 described above may be disposed on the firstinsulation layer 16, the first terminal electrode E1 may be electricallyconnected with the drain electrode DE via an opening O1, and the openingO1 may be formed with sidewalls of the protection layer 14 and the firstinsulation layer 16 above the drain electrode DE, but not limitedthereto. The second insulation layer 18 may be disposed on the firstinsulation layer 16, and the second insulation layer 18 may be disposedon the first terminal electrode E1, the light sensing unit PU, and thesecond terminal electrode E2 also. The first electrically conductivelayer 20 may be disposed on the second insulation layer 18, and thefirst electrically conductive layer 20 may be electrically connectedwith the light sensing unit PU and the second terminal electrode E2 forproviding a reference voltage (such as a second voltage V2 shown in FIG.3(a) and FIG. 3(c)) to the light sensing unit PU and the second terminalelectrode E2 via an opening O2. The opening O2 may be formed withsidewalls of the second insulation layer 18 located above the lightsensing unit PU, but not limited thereto. The third insulation layer 22may be disposed on the first electrically conductive layer 20 and thesecond insulation layer 18.

In some embodiments, the substrate 10 may be a rigid substrate or aflexible substrate, and the material of the substrate 10 may includeglass, plastic, ceramic materials, polyimide (PI), polyethyleneterephthalate (PET), an arrangement combination of the above-mentionedmaterials, or other materials suitable for forming the substrate. Thefirst gate electrode G1, the second gate electrode G2, the sourceelectrode SE, the drain electrode DE, the first terminal electrode E1,the second terminal electrode E2, and the first electrically conductivelayer 20 may respectively include electrically conductive materials,such as metallic conductive materials, transparent conductive materials,or other suitable types of electrically conductive materials. Themetallic conductive materials described above may include at least oneof aluminum, copper, silver, chromium, titanium, or molybdenum, acomposed layer of the above-mentioned materials, or an alloy of theabove-mentioned materials. The transparent conductive materialsdescribed above may include indium tin oxide (ITO), indium zinc oxide(IZO), aluminum zinc oxide (AZO), or other suitable transparentconductive materials. The materials of the gate dielectric layer 12, theprotection layer 14, the first insulation layer 16, the secondinsulation layer 18, and the third insulation layer 22 described abovemay respectively include inorganic materials, such as silicon nitride,silicon oxide, silicon oxynitride, aluminum oxide (Al₂O₃), and hafniumoxide (HfO₂), organic materials, such as acrylic resin, or othersuitable dielectric materials. In addition, the material of the activelayer SC described above may include an amorphous silicon semiconductormaterial, a polysilicon semiconductor material, an organic semiconductormaterial, an oxide semiconductor material (such as indium gallium zincoxide, IGZO), or other suitable semiconductor materials. It is worthnoting that the radiation sensing device of the present disclosure isnot limited to the structure shown in FIG. 2 and/or the materialproperties described above, and other suitable structures and/ormaterials may also be applied in the radiation sensing device of thepresent disclosure.

As shown in FIG. 2 , FIG. 3(a), FIG. 3(b), and FIG. 3(c), the first gateelectrode G1 of the semiconductor unit T may be connected to a scan lineSL, the source electrode SE of the semiconductor unit T may beelectrically connected to a data line DL, the drain electrode DE of thesemiconductor unit T may be electrically connected with the lightsensing unit PU, and another end of the light sensing unit PU may beconnected to a reference voltage (such as a second voltage V2). It isworth noting that the connection condition of the source electrode SEand the connection condition of the drain electrode DE in the presentdisclosure may be replaced with each other. In other words, in someembodiments, the drain electrode DE may be electrically connected to thedata line DL, and the source electrode SE may be electrically connectedwith the light sensing unit PU. In addition, the second gate electrodeG2 is not electrically connected with the source electrode SE, the drainelectrode DE, and the active layer SC. In some embodiments, as shown inFIG. 3(a), the second gate electrode G2 is not electrically connectedwith the light sensing unit PU. In some embodiments, as shown in FIG.3(b), the second gate electrode G2 is electrically connected with thelight sensing unit PU.

In some embodiments, the light sensing unit PU may be formed by anamorphous silicon (a-Si) deposition process. For example, the intrinsicsemiconductor layer P2 may be an intrinsic amorphous siliconsemiconductor layer, the first semiconductor layer P1 may be a P-typesemiconductor layer (such as a P-type doped amorphous siliconsemiconductor layer), the second semiconductor layer P3 may be an N-typesemiconductor layer (such as a N-type doped amorphous siliconsemiconductor layer), and the light sensing unit PU in this conditionmay be regarded as a PIN type photodiode (FIG. 3(a) may be thecorresponding schematic circuit diagram). Additionally, in someembodiments, the first semiconductor layer P1 may be an N-typesemiconductor layer (such as a N-type doped amorphous siliconsemiconductor layer), the second semiconductor layer P3 may be a P-typesemiconductor layer (such as a P-type doped amorphous siliconsemiconductor layer), and the light sensing unit PU in this conditionmay be regarded as a NIP type photodiode (FIG. 3(c) may be thecorresponding schematic circuit diagram), but not limited thereto.Additionally, in some embodiments, the radiation sensing device mayinclude a plurality of the semiconductor units T and the correspondinglight sensing units PU described above, the semiconductor units T andthe corresponding light sensing units PU may be disposed and arranged inan array configuration, and the radiation sensing device may be regardedas an active matrix radiation sensing panel, but not limited thereto.

Please refer to FIG. 1 and FIG. 4 . FIG. 4 is a schematic diagramillustrating timings of the radiation system according to an embodimentof the present disclosure. As shown in FIG. 4 , an operation method ofthe radiation sensing device 101 in this embodiment may include thefollowing steps. In some embodiments, the radiation sensing device 101may enter a standby mode after being powered on, and an irradiationstart signal may be transmitted to the radiation sensing device 101 andthe radiation generating device 901 by an operator before the formalexposure of the radiation (such as X-ray) by the radiation generatingdevice 901. In other words, the radiation sensing device 101 may enter aphotography mode from the standby mode by receiving the irradiationstart signal. It is worth noting that the radiation sensing device 101described is provided, and the radiation sensing device 101 is put intoa standby mode. The second gate electrode G2 has a positive bias voltageduring the standby mode, and the second gate electrode G2 may bepositively biased during the standby mode.

In the photography mode, some of the light sensing units PU may be usedto sense the radiation energy and accumulate the received radiationenergy, an irradiation stop signal may be received by the radiationgenerating device 901 for stopping the radiation subsequently, and acomprehensive scan may then be executed by the radiation sensing device101 for performing an image reading action. Finally, the photographymode may be ended after the image reading action is completed, and theradiation sensing device may return to the standby mode from thephotography mode after the image reading action. For example, before theirradiation is finished, the semiconductor unit T may be controlled bythe first gate electrode G1 to be closed, and a charge accumulationaction may be performed by the light sensing unit T exposed to theradiation. Comparatively, when the image reading action is performed,the semiconductor unit T may be controlled by the first gate electrodeG1 to be opened for reading signals from the light sensing unit PU.

In the operation method of the present disclosure, beyond the timebetween the radiation sensing device 101 receiving the irradiation startsignal and completing the image reading action (such as the photographymode shown in FIG. 4 ), the radiation sensing device 101 may be regardedas being put in the standby mode. In the standby mode, the semiconductorunit T may be controlled by the first gate electrode G1 to be closed,and a pixel reset action may be performed in the light sensing units PUfor being ready for the next radiation exposure. It is worth notingthat, in the standby node, the second gate electrode G2 may have apositive bias voltage (such as a first voltage V1 shown in FIG. 3(a) andFIG. 3(c)) for recovering the influence on electrical properties of thesemiconductor unit T after the semiconductor unit T is irradiated by theradiation, and the electrical performance of the semiconductor unit Tmay be recovered to be normal. In some embodiments, there may be not anyvoltage applied to the second gate electrode G2 during the photographymode described above, but not limited thereto.

Specifically, in some embodiments, by the influence of the energy and/orthe dose of the radiation during the irradiation, properties of stackedlayers in the semiconductor units T (such as the active layer SC, thegate dielectric layer 12, and/or the protection layer 14) may change,and the electrical performance of the semiconductor switching units maybe influenced accordingly. For instance, the energy gap of the activelayer SC and the portions of the active layer SC adjacent to otherdielectric layers (such as the gate dielectric layer 12 and theprotection layer 14) may be influenced by the radiation and benddownward, and negative shift in the threshold voltage (Vth) of thesemiconductor unit T may be generated accordingly. However, in thepresent disclosure, the electrons in the protection layer 14 mayaccumulate at a side adjacent to the active layer by positively biasingthe second gate electrode G2 of the radiation sensing device during thestandby mode, and the energy gap of the active layer SC may be recoveredto be the normal condition before being irradiated by the radiation. Inother words, by positively biasing the second gate electrode G2 for aspecific period during the standby mode, the energy gap of the activelayer SC may be raised to be normal, positive shift in the thresholdvoltage of the semiconductor unit T may be generated accordingly, andthe threshold voltage of the semiconductor unit T may be recovered to benormal.

For example, in the operation method of this embodiment, the second gateelectrode G2 may have a positive bias voltage during the standby mode ofthe radiation sensing device 101 for performing a recovery treatment,and a treatment time of the recovery treatment may range from 1 minuteto 60 minutes, from 5 minutes to 20 minutes, 5 minutes to 10 minutes, orother suitable time ranges. In other words, in some embodiments, thesecond gate electrode G2 may have a positive bias voltage during aportion of the period of the standby mode of the radiation sensingdevice 101 for providing the treatment effect described above, but notlimited thereto. In some embodiments, the second gate electrode G2 mayhave a positive bias voltage during the whole period of the standby modeof the radiation sensing device 101. In addition, a signal applied tothe second gate electrode G2 during the standby mode may include a DCsignal, an AC signal, or signals of other suitable types, and thepositive bias voltage applied to the second gate electrode G2 in therecovery treatment may range from 5 volts to 20 volts or other suitablevoltage ranges, and that may be adjusted according to design and willnot be limited thereto. In some embodiments, there may be not anyvoltage applied to the first gate electrode G1 during the recoverytreatment described above, but not limited thereto. In some embodiments,when the negative shift in the threshold voltage of the semiconductorunit T influenced by the radiation is too significant, the first gateelectrode G1 may be positively biased in the recovery treatmentdescribed above and/or in the standby mode described above for closingthe semiconductor unit T. In other words, the first gate electrode G1may also have a positive bias voltage in the standby mode, but notlimited thereto.

Please refer to FIG. 5 . FIG. 5 is a schematic diagram illustrating therelationship between a drain current (I_(D)) of the semiconductor unit Tin the radiation sensing device 101 and a gate voltage (V_(G)) of thesemiconductor unit T (I-V curve) in this embodiment, wherein a firstrelation line L1 stands for the I-V curve of the semiconductor unitafter being exposed to radiation, and a second relation line L2 standsfor the I-V curve of the semiconductor unit after being exposed toradiation and being treated by the recovery treatment described above.From the first relation line L1, it is known that the threshold voltageof the semiconductor unit T is negatively shifted due to the radiation.Then, from the second relation line L2, it is known that the recoveryeffect may be achieved by the positive bias voltage of the second gateelectrode G2 in the standby mode. In other words, the threshold voltageof the semiconductor unit T after the recovery treatment may be higherthan the threshold voltage of the semiconductor unit T before therecovery treatment.

By the radiation sensing device 101 and the operation method thereof inthe present disclosure, the influence of the radiation on the electricalproperties of the semiconductor unit T may be recovered, the electricalperformance of the semiconductor unit T may be recovered to be normal,the influence of the radiation exposure on the normal operation of theradiation sensing device 101 may be avoided, and the lifetime of theradiation sensing device 101 may be extended accordingly. For example,in some embodiments, the negative shift in the threshold voltage may berecovered with about 1 volt by modifying the manufacturing processes ofthe stacked layers (such as the active layer SC, the gate dielectriclayer 12, and/or the protection layer 14), and the negative shift in thethreshold voltage may be recovered with about 4 volts by the method ofpositively biasing the second gate electrode G2 in the presentdisclosure without modifying the process conditions of each of thestacked layers. Other negative influence of modifying the processconditions of each of the stacked layers (such as negative influence onthe stability and/or the reliability) may be avoided accordingly.

The following description will detail the different embodiments of thepresent disclosure. To simplify the description, identical components ineach of the following embodiments are marked with identical symbols. Formaking it easier to understand the differences between the embodiments,the following description will detail the dissimilarities amongdifferent embodiments and the identical features will not be redundantlydescribed.

Please refer to FIG. 6 . FIG. 6 is a schematic diagram illustrating aradiation sensing device 102 according to an exemplary example of thefirst embodiment of the present disclosure. As shown in FIG. 6 , theradiation sensing device 102 may further include an insulation layer 13disposed on the active layer SC, and the source electrode SE and thedrain electrode DE may be disposed on the insulation layer 13. In thisembodiment, the insulation layer 13 may be called an etching stop layerconfigured to protect the active layer SC during the manufacturingprocess of forming the source electrode SE and the drain electrode DE.

Please refer to FIG. 7 . FIG. 7 is a schematic diagram illustrating aradiation sensing device 103 according to another exemplary example ofthe first embodiment of the present disclosure. As shown in FIG. 7 , theinsulation layer 13 may be further sandwiched between the sourceelectrode SE and the active layer SC and between the drain electrode DEand the active layer SC. The insulation layer 13 may have a firstopening (such as an opening O3) and a second opening (such as an openingO4). The source electrode SE and the drain electrode DE may beelectrically connected with the active layer via the opening O3 and theopening O4 respectively, and the opening O3 and the opening O4 may beformed with sidewalls of the insulation layer 13 located above theactive layer SC, but not limited thereto.

Please refer to FIG. 8 and FIG. 9 . FIG. 8 is a schematic diagramillustrating a radiation sensing device 104 according to a secondembodiment of the present disclosure, and FIG. 9 is a schematic circuitdiagram of a part of the radiation sensing device 104 in the secondembodiment. As shown in FIG. 8 and FIG. 9 , in the radiation sensingdevice 104, the light sensing unit PU may include a capacitor structureCS optionally, and the capacitor structure CS may be formed with twoelectrically conductive layers and a dielectric material sandwichedbetween the two electrically conductive layers, such as being formedwith a fourth electrically conductive layer 17, a fifth electricallyconductive layer 19, and the second insulation layer 18, but not limitedthereto. In addition, the radiation sensing device 104 may furtherinclude a third electrically conductive layer 15, a fourth insulationlayer 21, and a second electrically conductive layer 24. The thirdelectrically conductive layer 15 may be disposed on the protection layer14, and the first insulation layer 16 may be disposed on the thirdelectrically conductive layer 15. The third electrically conductivelayer 15 may be electrically connected with the source electrode SE viaan opening O5 and electrically connected with the drain electrode DE viaan opening O6. The opening O5 and the opening O6 may be formed withsidewalls of the protection layer 14 above the source electrode SE andthe drain electrode DE. The fourth electrically conductive layer 17described above may be disposed on the first insulation layer 16, andthe fourth electrically conductive layer 17 may contact the thirdelectrically conductive layer 15 via an opening O7 penetrating the firstinsulation layer 16 above the third electrically conductive layer 15. Inother words, the fourth electrically conductive layer 17 may beelectrically connected with the drain electrode DE of the semiconductorunit T via the third electrically conductive layer 15, but not limitedthereto. The fifth electrically conductive layer 19 may be disposed onthe second insulation layer 18, and the first electrically conductivelayer 20 may be disposed on and electrically connected with the fifthelectrically conductive layer 19 for applying a reference voltage (suchas a second voltage V2 shown in FIG. 9 ) to the fifth electricallyconductive layer 19.

In addition, the fourth insulation layer 21 may be disposed on the firstelectrically conductive layer 20, the fifth electrically conductivelayer 19, and the second insulation layer 18. The third insulation layer22 may be disposed on the fourth insulation layer 21. The secondelectrically conductive layer 24 may be disposed on the third insulationlayer 22. The second electrically conductive layer 24 may beelectrically connected with the fourth electrically conductive layer 17via an opening O8, and the opening O8 may be formed with the sidewallsof the second insulation layer 18, the fourth insulation layer 21, andthe third insulation layer 22 above the fourth electrically conductivelayer 17, but not limited thereto. It is worth noting that, thecapacitor structure CS and specific material (such as selenium or othersuitable materials) disposed on the capacitor structure CS are used forsensing in this embodiment. A scintillator layer (not shown) may be usedfor the photodiode in the above-mentioned embodiments and convertingradiation into visible light, and light sensing may then be performed bythe photodiode accordingly, but not limited thereto.

To summarize the above descriptions, in the radiation sensing device andthe operation method thereof in the present disclosure, the second gateelectrode may have a positive bias voltage during the standby mode forrecovering the influence of the radiation on the electrical propertiesof the semiconductor unit, and the electrical performance of thesemiconductor unit may be recovered to be normal. The influence of theradiation exposure on the normal operation of the radiation sensingdevice may be avoided, and the lifetime of the radiation sensing devicemay be extended accordingly.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A radiation sensing device, comprising: asubstrate; a plurality of semiconductor units disposed on the substrate,wherein at least one of the semiconductor units comprises: a first gateelectrode; an active layer disposed on the first gate electrode; and asecond gate electrode disposed on the active layer, wherein the secondgate electrode has a positive bias voltage during a standby mode, andthere is not any voltage applied to the first gate electrode during thestandby mode; and at least one light sensing unit disposed on thesubstrate, wherein the at least one light sensing unit is notelectrically connected with the second gate electrode.
 2. The radiationsensing device according to claim 1, wherein the at least one lightsensing unit comprises: a first semiconductor layer; an intrinsicsemiconductor layer; and a second semiconductor layer, wherein theintrinsic semiconductor layer is sandwiched between the firstsemiconductor layer and the second semiconductor layer.
 3. The radiationsensing device according to claim 2, wherein the at least one of thesemiconductor units further comprises a source electrode and a drainelectrode, wherein one of the source electrode or the drain electrode iselectrically connected with the first semiconductor layer, the firstsemiconductor layer is a P-type semiconductor layer, and the secondsemiconductor layer is an N-type semiconductor layer.
 4. The radiationsensing device according to claim 2, wherein the at least one of thesemiconductor units further comprises a source electrode and a drainelectrode, wherein one of the source electrode or the drain electrode iselectrically connected with the first semiconductor layer, the firstsemiconductor layer is an N-type semiconductor layer, and the secondsemiconductor layer is a P-type semiconductor layer.
 5. The radiationsensing device according to claim 1, wherein the at least one lightsensing unit is electrically connected with the at least one of thesemiconductor units, and the at least one light sensing unit comprises acapacitor structure.
 6. The radiation sensing device according to claim1, further comprising: an insulation layer disposed on the active layer.7. The radiation sensing device according to claim 6, wherein theinsulation layer has a first opening and a second opening, and the atleast one of the semiconductor units further comprises a sourceelectrode and a drain electrode, wherein the source electrode iselectrically connected with the active layer via the first opening, andthe drain electrode is electrically connected with the active layer viathe second opening.